| PART |
Description |
Maker |
| HEDS-6500-A05 HEDS-6500-A10 HEDS-6500-A11 HEDS-650 |
HEDS-6510#005 · Large Diameter (56mm), Housed Two and Three Channel Optical Encoders
HEDS-6505#B05 · Large Diameter (56mm), Housed Two and Three Channel Optical Encoders
HEDS-6500#A05 · Large Diameter (56mm), Housed Two and Three Channel Optical Encoders
HEDM-6500#T05 · Large Diameter (56mm), Housed Two and Three Channel Optical Encoders
HEDM-6505#T05 · Large Diameter (56mm), Housed Two and Three Channel Optical Encoders
HEDL-6545#B09 · Large Diameter (56mm), Housed Two and Three Channel Optical Encoders
HEDL-6540#B11 · Large Diameter (56mm), Housed Two and Three Channel Optical Encoders
HEDM-6540#T11 · Large Diameter (56mm), Housed Two and Three Channel Optical Encoders
Large Diameter (56 mm), Housed Two and Three Channel Optical Enco
|
Agilent (Hewlett-Packard)
HP[Agilent(Hewlett-Packard)]
|
| HEDM-65XX |
Large Diameter (56mm),Housed Two and Three Channel Optical Encoders(大的直径(56mm),含有两个和三个通道的光编码
|
Agilent(Hewlett-Packard)
|
| 44067-0403 0440670403 |
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 4 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
3.00mm (.118") Pitch Micro-Fit 3.0垄芒 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 4 Circuits, 0.76楼矛m (30楼矛") Gold (Au) Selectiv
|
Molex Electronics Ltd.
|
| 0440671403 44067-1403 |
3.00mm (.118) Pitch Micro-Fit 3.0?/a> Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
3.00mm (.118") Pitch Micro-Fit 3.0垄芒 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 14 Circuits, 0.76楼矛m (30楼矛") Gold (Au) Selecti
MOLEX Connector
|
Molex Electronics Ltd.
|
| 0440672401 SD-44067-001 44067-2401 |
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB
MOLEX Connector
|
Molex Electronics Ltd.
|
| PE1001-4 |
Hermetic Seal Solder Contact With 0.02 Pin Diameter, 0.158 Body Diameter And 0.07 Pin Length
|
Pasternack Enterprises, Inc.
|
| STK4160MK5 STK4190K5 STK4190MK5 STK4120MK5 STK4110 |
30W x 2-channel power amplifier
2ch./1packge - Power Supply 6W/ch. ~ 100W/ch. THD=0.08%
2ch./1packge, - Power Supply 6W/ch. ~ 100W/ch. THD=0.08%
PIEZO-BUZZER 4.096KHZ 15MM-DIA 9.5NF-30% W/CASING BULK
STK Audio Power Amplifier 沙头角音频功率放大器
TRANSDUCER AUDIO ; Capacitance:14nF; Connector type:2 pin; Diameter, external:28mm; Diameter, panel cut-out:19.05mm; Diameter, pin:0.95mm; Distance, sound level:30cm; Frequency:3500Hz; Frequency, capacitance measurement:1kHz;
|
SANYO[Sanyo Semicon Device]
Sanyo Electric Co.,Ltd.
Sanyo Electric Co., Ltd.
|
| 461-3102 |
Connector pin for patch lead ends, .025 (0,64) diameter pin
|
CAMBION Electronic Components
|
| 460-3299 |
Crimp connector pin, .080 (2,03) diameter pin
|
CAMBION Electronic Components
|
| LCM-S01602DSR-A LCM-S01602DSRA |
5.56mm CHARACTER HEIGHT, 5x8 DOT MATRIX, 16x2 LCD MODULE
5.56MM CHARACTER HEIGHT 5 X8 DOT MATRIX
|
LUMEX INC.
|
| 0050842040 050-84-2040 42022-4A |
2.13mm (.084) Diameter MLX Pin and Socket Receptacle, 4 Circuits
2.13mm (.084") Diameter MLX Pin and Socket Receptacle, 4 Circuits
MOLEX Connector
|
Molex Electronics Ltd.
|
